ASTRON®ex反應(yīng)性氣體發(fā)生器是我們產(chǎn)量的獨(dú)立式反應(yīng)性氣體源，用于室清洗和其他反應(yīng)性氣體應(yīng)用。ASTRONex反應(yīng)氣體發(fā)生器采用的低場(chǎng)環(huán)形等離子體技術(shù)，有效地分離輸入氣體，產(chǎn)生下游反應(yīng)化學(xué)物質(zhì)。的高功率設(shè)計(jì)有效地分離替代氣體，如C3、F8和CF4
． 增加的流動(dòng)能力為這些替代工藝氣體的經(jīng)濟(jì)高效使用提供了足夠的反應(yīng)氣體產(chǎn)量。與其他等離子體生成技術(shù)相比，ASTRONex反應(yīng)氣體發(fā)生器效率更高，擁有成本更低，能夠從NF3、C3、F8、CF4和其他氣體中產(chǎn)生高流量。該設(shè)計(jì)架構(gòu)集電源、控制為一體
模塊，與等離子體室合并成一個(gè)緊湊的模塊。由于界面簡(jiǎn)單，ASTRONex反應(yīng)氣體發(fā)生器可以輕松集成到新的和現(xiàn)有的生產(chǎn)工具中。
ASTRONex反應(yīng)氣體發(fā)生器的主要應(yīng)用是作為反應(yīng)氣體的遠(yuǎn)程來(lái)源，使用替代氣體清潔工藝室內(nèi)壁上的沉積物;或者需要高通量的反應(yīng)物。通過(guò)產(chǎn)生氟原子與腔室中的沉積物發(fā)生反應(yīng)，形成新的氣體，這些氣體很容易被擦洗，以限度地減少對(duì)環(huán)境的影響。此外，與原位射頻方法相比，等離子體源的遠(yuǎn)程位置減少了對(duì)工藝室的磨損。

The ASTRON®ex reactive gas generator is our highest output, self-contained reactive species source for chamber cleaning and other reactive gas applications. The ASTRONex reactive gas generator uses patented Low-Field-Toroidal plasma technology to efficiently dissociate input gas to produce downstream reactive chemistries. The unique high power design effectively dissociates alternative gases such as C3 F8 and CF4
. The increased flow capability provides sufficient reactive gas production for cost-effective use of these alternative process gases. Relative to other plasma generating technologies, the ASTRONex reactive gas generator is more efficient, has lower cost of ownership and is capable of producing high flows from NF3 , C3 F8 , CF4 , and other gases. The design architecture integrates the power source, control
module, and plasma chamber into a single compact module. Due to its simple interface, the ASTRONex reactive gas generator is easily integrated onto both new and existing production tools.
The primary application for the ASTRONex reactive gas generator is as a remote source of reactive gas to clean deposits from interior walls of process chambers using alternative gases; or where high fluxes of a reactant species are required. By generating atomic fluorine that reacts with deposits in the chamber, new gases are formed that are easily scrubbed to minimize the environmental impact. In addition, the remote location of the plasma source reduces wear and tear on the process chamber compared to in situ RF methods.